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DTSTART;TZID=America/Chicago:20251103T120000
DTEND;TZID=America/Chicago:20251103T130000
DTSTAMP:20260403T151242
CREATED:20250827T171205Z
LAST-MODIFIED:20251028T231824Z
UID:10001297-1762171200-1762174800@engineering.wisc.edu
SUMMARY:BME Seminar Series: EnsoData
DESCRIPTION:The Entrepreneurial Journey of EnsoData Co-Founders\n\n\n\nChris Fernandez BMEBS’14\, MS’15; Ensodata Co-founder\, Executive Chairman and Chief Research OfficerNick Glattard BMEBS’14\, MS’15; EnsoData Co-founder and Chief Technology Officer \n\n\n\nHear firsthand how two BME alumni turned a bold idea into a nationally recognized startup. \n\n\n\nNick Glattard (BMEBS ’14\, MS ’15) and Chris Fernandez (BMEBS ’14\, MS ’15)\, Cofounders of EnsoData\, will share their remarkable journey from UW–Madison biomedical engineering students to leading a cutting-edge company that’s transforming sleep medicine. Their presentation will delve into the challenges and triumphs of building EnsoData. \n\n\n\nPrint PDF
URL:https://engineering.wisc.edu/event/bme-seminar-series-3/
LOCATION:1003 (Tong Auditorium) Engineering Centers Building\, 1550 Engineering Drive\, Madison\, WI\, 53706\, United States
CATEGORIES:Biomedical Engineering,Seminar
ATTACH;FMTTYPE=image/jpeg:https://engineering.wisc.edu/wp-content/uploads/2024/11/Seminar-Graphic-Fall2024-1.avif
ORGANIZER;CN="Department of Biomedical Engineering":MAILTO:bmehelp@bme.wisc.edu
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20251103T180000
DTEND;TZID=America/Chicago:20251103T200000
DTSTAMP:20260403T151242
CREATED:20251029T150247Z
LAST-MODIFIED:20251029T150249Z
UID:10001359-1762192800-1762200000@engineering.wisc.edu
SUMMARY:ISyE - Ice cream social\, hosted by IISE
DESCRIPTION:Memorial Union \n\n\n\nPlease join IISE for an ice cream social at one of our favorite places – Memorial Union. This event is especially geared for our freshmen\, but is open to all Industrial Engineering students.  Enjoy ice cream\, games\, and a chance to meet your fellow classmates.
URL:https://engineering.wisc.edu/event/isye-ice-cream-social-hosted-by-iise/
LOCATION:Memorial Union\, 800 Langdon St\, Madison\, Wisconsin\, 53706\, United States
CATEGORIES:Industrial & Systems Engineering,Social Event,Student Org Event
ATTACH;FMTTYPE=image/jpeg:https://engineering.wisc.edu/wp-content/uploads/2025/10/IceCreamSocial.avif
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20251104T120000
DTEND;TZID=America/Chicago:20251104T140000
DTSTAMP:20260403T151242
CREATED:20251028T184952Z
LAST-MODIFIED:20251028T190418Z
UID:10001357-1762257600-1762264800@engineering.wisc.edu
SUMMARY:WECE Coffee Break with Adria Brooks
DESCRIPTION:Join Women in Electrical and Computer Engineering (WECE) for a coffee break with ECE alumna Dr. Adria Brooks\, Director of Transmission Planning at Grid Strategies LLC. Stop by at any time from noon to 2:00 to enjoy free Einstein bagels and coffee. \n\n\n\nDr. Brooks is a recipient of a 2025 College of Engineering Early Career Award which will be presented on Engineers’ Day\, November 7. \n\n\n\nLinkedIn
URL:https://engineering.wisc.edu/event/wece-coffee-break-with-adria-brooks/
LOCATION:4610 Engineering Hall\, 1415 Engineering Drive\, Madison\, 53711
CATEGORIES:Alumni events,Electrical & Computer Engineering
ATTACH;FMTTYPE=image/png:https://engineering.wisc.edu/wp-content/uploads/2025/10/image-4.avif
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20251105T090000
DTEND;TZID=America/Chicago:20251105T100000
DTSTAMP:20260403T151242
CREATED:20250515T144037Z
LAST-MODIFIED:20250515T144042Z
UID:10001239-1762333200-1762336800@engineering.wisc.edu
SUMMARY:Grad School Virtual Info Session
DESCRIPTION:Join us to learn more about graduate school with the Department of Mechanical Engineering at UW-Madison! We will be hosting virtual sessions on the first Wednesday of every month from June through December from 9:00-10:00am CST. Please RSVP here. \n\n\n\nThose who attend will learn more about: \n\n\n\n\nMechanical Engineering Department programs overview (including department research overview)\n\n\n\nResearch MS and PhD program information\n\n\n\nProfessional (course-only) based MS program information\n\n\n\nAdmissions Information\n\n\n\nFaculty & Graduate Student Panel\n\n\n\nQ&A\n\n\n\nMuch More!\n\n\n\n\nQuestions? Email us at dept@me.engr.wisc.edu
URL:https://engineering.wisc.edu/event/grad-school-virtual-info-session-8/
LOCATION:Wisconsin
CATEGORIES:Mechanical Engineering
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20251105T150000
DTEND;TZID=America/Chicago:20251105T160000
DTSTAMP:20260403T151242
CREATED:20251002T131359Z
LAST-MODIFIED:20251002T132637Z
UID:10001317-1762354800-1762358400@engineering.wisc.edu
SUMMARY:ECE Distinguished Speaker Seminar Series: Professor Grace Xing
DESCRIPTION:AlN – a New Platform for Electronics\n\n\n\n\n\n\n\nAbstract:AlN has been ardently pursued as one of the most promising ultra-wide bandgap semiconductors (UWBGs) after GaN and SiC as the industry has been expanding rapidly on the high-volume manufacturing of GaN and SiC based technologies\, including 12-inch GaN-on-Si\, 8-inch SiC substrates and processing foundries etc. AlN is CMOS compatible with high thermal conductivity\, high acoustic velocity and a rich family of heterostructures. Recently\, Sc-\, B- and Y-doped AlN alloys have garnered tremendous interest for their ferroelectric behavior. In this talk\, I will focus on findings in our journey to develop new electronic devices on AlN in the past two decades.  \n\n\n\nWurtzite III-nitrides are well known as a family of polar semiconductors. When sandwiching a narrow gap III-nitride layer with wider gap barrier materials\, one interface is characterized as the negative polarization charge interface while the other as the positive polarization charge interface. The polarization charges are fixed in space and emanating electric field while the entire material stack will do everything it can to minimize its total free energy due to the thermodynamic driving force. As a result\, compensating charges can be generated: either mobile charge carriers including delocalized electrons and holes\, or charged defect states that are localized in the real and energy space. If undesired defect formation is sufficiently suppressed in the heterostructure\, mobile charge carriers will be generated and can be harvested for electronic applications. To this end\, we succeeded in generating both mobile electrons and holes in thin GaN quantum well sandwiched by AlN. I will discuss how we generate and detect these mobile charges\, and some demonstrated utilities in terms of fundamental understanding and practical applications. \n\n\n\nProfessor Grace Xing\n\n\n\nBio:Huili Grace Xing is currently the Director of SUPREME – a SRC JUMP2.0 research center\, the William L. Quackenbush Professor of Electrical and Computer Engineering\, Materials Science and Engineering at Cornell University\, and has recently served as the Associate Dean for Research & Graduate Studies of the College of Engineering. \n\n\n\nShe is a recipient of the AFOSR Young Investigator Award\, NSF CAREER Award\, ISCS Young Scientist Award\, the Intel Outstanding Researcher Award\, and the SIA/SRC University Researcher Award. She is a fellow of APS\, IEEE & AAAS. \n\n\n\nXing received a B.S. in physics from Peking University\, M.S. in Material Science from Lehigh University and Ph.D. in Electrical Engineering from University of California\, Santa Barbara\, respectively. She was a faculty member with the University of Notre Dame from 2004 to 2014. Her research focuses on development of III-V nitrides\, 2-D crystals\, oxide semiconductors\, recently also multiferroics & magnetic materials: growth\, electronic and optoelectronic devices\, especially the interplay between material properties and device development for high performance devices\, including RF/THz devices\, tunnel field effect transistors\, power electronics\, DUV emitters and memories. Together with her colleague Debdeep Jena\, they were the first to demonstrate distributed polarization doping (DPD)\, especially the p-type DPD in nitride semiconductors. This doping scheme is fundamentally different from impurity doping and modulation doping\, thus dubbed as the 3rd generation of doping science by Xing. Polarization doping is particularly powerful in polar ultrawide bandgap semiconductors since it might be the only known method to achieve both n-type and p-type in an UWBG semiconductor with doping properties akin to shallow impurity dopants. \n\n\n\nXing has delivered 200+ invited talks and seminars\, and has authored/co-authored 350+ journal papers including Nature journals\, Physical Review Letters\, Applied Physics Letters\, Electron Device Letters\, and 140+ conference proceeding publications in IEDM\, ISPSD etc. Her h-index is 89 on google scholar.
URL:https://engineering.wisc.edu/event/ece-distinguished-speaker-seminar-series-prof-grace-xing/
LOCATION:2305 Engineering Hall\, 1415 Engineering Drive\, Madison\, WI\, 53706\, United States
CATEGORIES:Electrical & Computer Engineering,Seminar
ATTACH;FMTTYPE=image/jpeg:https://engineering.wisc.edu/wp-content/uploads/2025/09/Distinguished-Speaker-Seminar-Series-3.avif
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20251106T120000
DTEND;TZID=America/Chicago:20251106T130000
DTSTAMP:20260403T151242
CREATED:20251016T183753Z
LAST-MODIFIED:20251023T183311Z
UID:10001352-1762430400-1762434000@engineering.wisc.edu
SUMMARY:NEEP Seminar Series: Michael Tonks\, University of Florida
DESCRIPTION:Thursday\, November 612:00 – 1:00pm106 Engineering Research BuildingPlease contact office@neep.wisc.edu for assistance with remote participation. \n\n\n\nAn electrochemical phase-field model for the corrosion of structural alloys by molten saltsModeling and simulation must play a critical role in accelerating the development and qualification of materials for advanced reactors\, such as molten salt reactors (MSRs). MSRs are an advanced reactor concept that uses molten salts as either the coolant or both coolant and fuel solvent. However\, molten salts can corrode salt facing alloys\, introducing corrosion products into the salt that can precipitate in the cold leg of the loop. To evaluate and improve alloy corrosion behavior\, we have developed an electrochemical phase-field model for capturing the microstructure-dependent corrosion of structural alloys by molten salts. The model has been applied to the corrosion of nickel-based alloys and stainless steels by molten fluoride and chloride salts. It can represent impurity-limited corrosion in static corrosion experiments and includes the role of activity gradient corrosion with dissimilar alloys for the alloy coupon and salt capsule. We have also applied the model to investigate the impact of pure Ni coatings on the corrosion of Ni-Cr alloys. Working with Drs. Couet and Sridharan\, we are adding the impact of radiation to the model. We are also working with them and Dr. Zhang on better understanding the impact of water vapor on corrosion. \n\n\n\n\n\n\n\nMichael R Tonks is the Interim Department Chair and Alumni Professor of Materials Science and Engineering and Nuclear Engineering at the University of Florida. Prior to joining UF in the Fall of 2017\, he was an Assistant Professor of Nuclear Engineering at the Pennsylvania State University for two years and a staff scientist in the Fuels Modeling and Simulation Department at Idaho National Laboratory for six years. Prof. Tonks was the original creator of the mesoscale fuel performance tool MARMOT and lead its development for five years. He helped to pioneer the approach taken in the DOE Nuclear Energy Advanced Modeling and Simulation (NEAMS) program to use multiscale modeling and simulation to inform the development of materials models for the BISON fuel performance tool that are based on microstructure rather than burn-up\, and he won the NEAMS Excellence Award for that work in 2014. He also won the Presidential Early Career Award for Scientists and Engineers in 2017 and the TMS Brimacombe medal in 2022. His research is focused on using mesoscale modeling and simulation results coupled with experimental data to investigate the co-evolution of microstructure and properties in materials in harsh environments.
URL:https://engineering.wisc.edu/event/neep-seminar-series-michael-tonks-university-of-florida/
LOCATION:Wisconsin
CATEGORIES:Nuclear Engineering & Engineering Physics
ATTACH;FMTTYPE=image/jpeg:https://engineering.wisc.edu/wp-content/uploads/2025/02/NEEP-Seminar-Series_Events-Page-Feature-Image.avif
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20251106T130000
DTEND;TZID=America/Chicago:20251106T140000
DTSTAMP:20260403T151242
CREATED:20251105T222332Z
LAST-MODIFIED:20251105T224359Z
UID:10001367-1762434000-1762437600@engineering.wisc.edu
SUMMARY:MS&E Seminar Series: Cyprian Emeka Uzoh
DESCRIPTION:UW-Madison Department of Materials Science and Engineering welcomes Cyprian Emeka Uzoh.  His seminar\, “Advances in high-performance metallization and packaging for advanced semiconductor applications”\, will take place on Thursday\, November 6 from 1-2 p.m. in MSE 265. \n\n\n\n\n\n\n\nBio \n\n\n\nCyprian Emeka Uzoh earned a Bachelor’s degree in Metallurgical Engineering from the University of Wisconsin–Madison in 1978\, followed by graduate studies at Rensselaer Polytechnic Institute. He began his career as a research scientist at IBM’s Thomas J. Watson Research Center\, where his pioneering contributions to semiconductor metallization laid the groundwork for transformative advances in the field. Following his tenure at IBM\, Uzoh continued to drive innovation through leadership roles in several leading technology companies\, advancing the development and commercialization of cutting-edge metallization and packaging technologies. His inventions have become the foundation for modern high-performance devices\, enabling the scalable fabrication of CPUs\, GPUs\, high-bandwidth memory\, and advanced image sensors used worldwide. In late 1980s and early 1990s his discovery of the bottom-up metal filling process for submicron vias and trenches\, along with the demonstration of its scalability to feature sizes below 100nm\, would mark a significant advancement in semiconductor manufacturing. These innovations\, combined with other Uzoh’s related contributions\, enabled the fabrication of lower-cost microchips with both larger and smaller form factors\, increased transistor density\, and improved electrical performance. The resulting enhancements in interconnect efficiency and reliability have had a lasting impact on the performance and scalability of modern integrated circuits. Uzoh and his colleagues at IBM Research were named “Inventor of the Year 2006” for his discovery of the bottom-up metal filling process and their development of the copper interconnect technology. Uzoh is also a prolific inventor\, with 404 Utility patents in the US and more than 750 worldwide. \n\n\n\n \n\n\n\nAbstract \n\n\n\nCopper interconnects have become a foundational component in advanced semiconductor manufacturing\, serving as critical enablers for high-performance integrated circuits. Their low resistivity\, high electromigration resistance\, and compatibility with damascene processing have made them indispensable for fabricating leading-edge devices such as GPUs\, CPUs\, NPUs\, high-bandwidth memory (HBM) modules\, interposers\, and CMOS image sensors. These components are integral to a broad spectrum of systems\, ranging from edge devices like IoT nodes and mobile platforms to high-performance computing infrastructure\, including data centers and exascale supercomputers. As device scaling continues and interconnect bottlenecks increasingly constrain system performance\, the role of copper interconnects in achieving low-latency\, high-throughput\, and thermally optimized architectures remains critical. This discussion will explore the development and impact of pivotal innovations\, including the invention of the proximity plating cell\, bottom-up metal deposition in large cavities (ECMD)\, and the elimination of terminal effects in electroplating\, each of which challenged established principles of electrodeposition kinetics. In addition\, Uzoh will present in detail his pioneering work in enabling high-density 3D integrated circuits (3D-ICs) and the commercialization of hybrid bonding\, a technique that allows for ultra-dense\, high-performance chip stacking without the need for adhesive layers.
URL:https://engineering.wisc.edu/event/mse-seminar-series-cyprian-emeka-uzoh/
LOCATION:Wisconsin
CATEGORIES:Materials Science & Engineering
ATTACH;FMTTYPE=image/png:https://engineering.wisc.edu/wp-content/uploads/2025/10/WEB-EVENT.avif
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20251106T160000
DTEND;TZID=America/Chicago:20251106T170000
DTSTAMP:20260403T151242
CREATED:20250811T165038Z
LAST-MODIFIED:20250811T165040Z
UID:10001266-1762444800-1762448400@engineering.wisc.edu
SUMMARY:ME 903 Graduate Seminar: Laura Grossenbacher
DESCRIPTION:The ME 903: Graduate Student Lecture Series features campus and visiting speakers who present on a variety of research topics in the field of mechanical engineering. Laura Grossenbacher is the Director of Technical Communications for the Interdisciplinary Professional Programs with the College of Engineering at UW-Madison.
URL:https://engineering.wisc.edu/event/me-903-graduate-seminar-laura-grossenbacher/
LOCATION:3M Auditorium\, rm 1106 Mechanical Engineering Building\, 1513 University Ave\, Madison\, 53711
CATEGORIES:Mechanical Engineering,Seminar
ATTACH;FMTTYPE=image/jpeg:https://engineering.wisc.edu/wp-content/uploads/2024/08/Event-Graphics-for-Calendar-12-jpg.avif
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20251106T173000
DTEND;TZID=America/Chicago:20251106T190000
DTSTAMP:20260403T151242
CREATED:20251014T162106Z
LAST-MODIFIED:20251014T162109Z
UID:10001351-1762450200-1762455600@engineering.wisc.edu
SUMMARY:ISYE - Scholarship Reception
DESCRIPTION:Join the Department of ISyE as we celebrate our 2025-2026 scholarship recipients. \n\n\n\n \n\n\n\nHelp ISyE celebrate our student scholarship recipients and thank our generous donors. There will be a brief ceremony\, followed by a casual reception.  RSVPs are required – scholarship recipients are asked to check their emails for an invitation.  Donors may contact Jane Feller (jfeller3@wisc.edu) for more information.
URL:https://engineering.wisc.edu/event/isye-scholarship-reception/
LOCATION:Atrium – Mechanical Engineering Building\, 1513 University Avenue\, Madison\, 53706
CATEGORIES:Industrial & Systems Engineering
ATTACH;FMTTYPE=image/jpeg:https://engineering.wisc.edu/wp-content/uploads/2024/11/UW-ISyE-Scholarship-Reception-2024_5-scaled.avif
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20251107T110000
DTEND;TZID=America/Chicago:20251107T120000
DTSTAMP:20260403T151242
CREATED:20250825T200005Z
LAST-MODIFIED:20251103T144412Z
UID:10001279-1762513200-1762516800@engineering.wisc.edu
SUMMARY:Midwest Mechanics Seminar: Professor Dennis Kochmann
DESCRIPTION:The Mechanics Seminar Series is a weekly seminar given by campus and visiting speakers on topics across the spectrum of mechanics research (solids\, fluids\, and dynamics). Professor Dennis Kochmann is professor at the Zurich Institute for Mechanical Systems.
URL:https://engineering.wisc.edu/event/midwest-mechanics-seminar-professor-dennis-kochman/
LOCATION:3M Auditorium\, rm 1106 Mechanical Engineering Building\, 1513 University Ave\, Madison\, 53711
CATEGORIES:Mechanical Engineering,Seminar
ATTACH;FMTTYPE=image/jpeg:https://engineering.wisc.edu/wp-content/uploads/2024/08/Event-Graphics-for-Calendar-11-jpg.avif
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20251107T113000
DTEND;TZID=America/Chicago:20251107T133000
DTSTAMP:20260403T151242
CREATED:20240104T193331Z
LAST-MODIFIED:20250902T180308Z
UID:10000468-1762515000-1762522200@engineering.wisc.edu
SUMMARY:CEE Engineers' Day Luncheon
DESCRIPTION:Join alumni\, faculty\, staff and industry partners as we celebrate Engineers’ Day and honor our 2025 award recipients on Friday\, November 7\, at Olbrich Botanical Gardens. To assist with planning\, please register by October 30. \n\n\n\n\nRegister now\n\n\n\n\nGabriel Lepak\, Victoria (Tori) Nelson\, Jan Kucher\, Greg Harrington\, Henry Byers\, and Kimberly Gonzalez\, PE\, pose with NCEES awards during Engineers’ Day 2024.\n\n\n\n \n\n\n\nCheck-in and refreshments begin at 11:30 a.m.\, followed by lunch from Blue Plate Catering at 12:00 p.m.\, and a short program. This year’s honorees are: \n\n\n\n\nColin Fitzgerald\, BSCE 2011\, MSCE 2013\, Global Principal for Water Resource Recovery at Jacobs\n\n\n\n\n \n\n\n\n\nDr. Berrin Tansel\, PhD 1984\, Professor of Environmental Engineering and Undergraduate Program Director at Florida International University\n\n\n\n\n \n\n\n\n\n2025 NCEES award-winning capstone design teams for the historic Riverview Terrace project ($10\,000 award) and Wausau Transit Facility project ($10\,000 award)\n\n\n\n\nAll meals include a garden salad\, starch/grains\, fresh baked dinner rolls\, and dessert. For the main dish\, you may choose from: \n\n\n\n\nBrandied chicken breast – sautéed chicken breast with a blend of chutney\, brandy\, and fresh herbs\n\n\n\n\n \n\n\n\n\nBaked cod served with tartar sauce and a lemon wedge\n\n\n\n\n \n\n\n\n\nStuffed acorn squash with curry seasoned ancient grains quinoa salad and topped with red pepper coulis (vegan/gf)\n\n\n\n\nMeals are $30 per person for alumni and friends of the department. Payment may be made on the day of the event via check or cash. Ample parking onsite is available free of charge. \n\n\n\nCEE faculty and staff\, along with Visiting Committee members\, emeritus faculty\, and award winners\, are invited at no cost.
URL:https://engineering.wisc.edu/event/cee-engineers-day-luncheon/
LOCATION:Olbrich Botanical Gardens\, 3330 Atwood Avenue\, Madison\, Wisconsin\, 53704
CATEGORIES:Alumni events,Civil & Environmental Engineering
ATTACH;FMTTYPE=image/jpeg:https://engineering.wisc.edu/wp-content/uploads/2022/06/Olbrich.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20251107T114500
DTEND;TZID=America/Chicago:20251107T130000
DTSTAMP:20260403T151242
CREATED:20251029T190719Z
LAST-MODIFIED:20251106T201352Z
UID:10001360-1762515900-1762520400@engineering.wisc.edu
SUMMARY:ISyE -Semi-annual alumni/student lunch!
DESCRIPTION:3126 ME \n\n\n\nJoin us for our semi-annual student/alumni lunch! \n\n\n\nOur Industrial Advisory Board and our E-Day honorees will be visiting our department on Friday\, November 7. All ISyE students are invited to join them for a casual lunch. This is a great opportunity to network with some of our department’s most accomplished alumni! \n\n\n\n \n\n\n\n\nMeet the UW-ISyE Industrial Advisory Board members
URL:https://engineering.wisc.edu/event/isye-semi-annual-alumni-student-lunch/
LOCATION:3126 Mechanical Engineering Building\, 1513 University Avenue\, Madison\, Wisconsin\, 53706
CATEGORIES:Alumni events,Industrial & Systems Engineering,Social Event
ATTACH;FMTTYPE=image/jpeg:https://engineering.wisc.edu/wp-content/uploads/2024/10/Lunch-scaled.avif
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20251107T120000
DTEND;TZID=America/Chicago:20251107T130000
DTSTAMP:20260403T151242
CREATED:20251104T154905Z
LAST-MODIFIED:20251104T154947Z
UID:10001363-1762516800-1762520400@engineering.wisc.edu
SUMMARY:ECE Tech Talk with Pankaj Patel
DESCRIPTION:Pankaj Patel\n\n\n\nJoin us for pizza and a conversation with Nile Chief Executive Officer and Co-founder\, Pankaj Patel. Patel will discuss his career path and share about his leadership in advancing next-generation network connectivity solutions and enterprise technology at Nile and\, previously\, Cisco Systems\, Inc. This is a great opportunity to have your questions answered by a #BadgerEngineer. In recognition of his achievements throughout his career\, Pankaj is receiving a College of Engineering Distinguished Alumni Achievement Award.
URL:https://engineering.wisc.edu/event/ece-tech-talk-with-pankaj-patel/
LOCATION:2317 Engineering Hall\, 1415 Engineering Drive\, Madison\, 53711
CATEGORIES:Alumni events,Electrical & Computer Engineering,Featured Guest Speaker
ATTACH;FMTTYPE=image/jpeg:https://engineering.wisc.edu/wp-content/uploads/2025/11/ECE-Tech-Talk-with-Pankaj-Patel.avif
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20251107T120000
DTEND;TZID=America/Chicago:20251107T140000
DTSTAMP:20260403T151242
CREATED:20250730T180331Z
LAST-MODIFIED:20250801T144138Z
UID:10001258-1762516800-1762524000@engineering.wisc.edu
SUMMARY:ME Engineers’ Day Luncheon & Lecture
DESCRIPTION:This free annual celebration gives Mechanical Engineering alumni an opportunity to meet with our current and emeritus faculty\, members of our Industrial Advisory Board\, department staff\, and other friends. \n\n\n\nThe 2025 Engineers’ Day luncheon will begin at 12pm in the DeLuca Forum at the Discovery Center Building\, include a brief program recognizing the 2025 honorees\, and wrap up with a special ME150th Anniversary Lecture by Professor Emeritus Tim Osswald. Our 2025 honorees are Amir Mirzendehdel\, Donald Wahlin\, and 2024 honoree David Bierman.  \n\n\n\nRegister Now! Contact cscott8@wisc.edu with any questions.
URL:https://engineering.wisc.edu/event/me-engineers-day-2025-luncheon-lecture/
LOCATION:Wisconsin Institute for Discovery\, 330 North Orchard St.\, Madison\, WI\, 53715\, United States
CATEGORIES:Alumni events,Mechanical Engineering
ATTACH;FMTTYPE=image/png:https://engineering.wisc.edu/wp-content/uploads/2025/07/UW-ME-150_Primary_Logo-e1754059287456.avif
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20251107T140000
DTEND;TZID=America/Chicago:20251107T150000
DTSTAMP:20260403T151242
CREATED:20251023T161907Z
LAST-MODIFIED:20251103T194623Z
UID:10001356-1762524000-1762527600@engineering.wisc.edu
SUMMARY:Fireside Chat: Barriers to New Nuclear (and How to Overcome Them)
DESCRIPTION:Friday\, November 72:00 – 3:00 PMMorgridge Hall Room 2516 \n\n\n\nJoin NEEP alumni Erik Nygaard and Kevin Nordt for a fireside chat as they discuss the barriers to new nuclear and their different perspectives on how to overcome those barriers to deploy next generation nuclear energy. \n\n\n\n\n\n\n\n\nKevin Nordt is the Executive Vice President-Chief Strategy Officer at Dairyland Power Cooperative\, headquartered in La Crosse\, WI. Nordt is an experienced energy executive\, with more than thirty-five years of experience\, in the power industry. At Dairyland Power\, he is responsible for the overall corporate strategy\, power supply portfolio management\, resource development\, and heads the coop’s advanced nuclear energy program. Over his career\, Nordt has worked in both private and public power companies holding various engineering\, finance\, trading\, and senior executive positions. He holds an MS in Nuclear Engineering & Engineering Physics\, from UW-Madison\, and BS in Mathematical Physics\, from St. John’s University\, NYC. \n\n\n\n\n \n\n\n\n\nErik Nygaard is the Acting President and Director of Product Development for BWXT Advanced Technologies\, LLC\, a subsidiary of BWX Technologies\, Inc. (BWXT). Mr. Nygaard is responsible for the development of new products for Advanced Technologies\, LLC\, which includes commercial microreactors for terrestrial and maritime applications\, data science solutions\, and advanced manufacturing techniques. \n\n\n\nPreviously\, he served as the director of Research and Engineering leading the organization’s design and technology development efforts for customers like NASA and the Department of Defense. He previously served as the Director of Isotope Research and Development\, overseeing the company’s medical isotope technologies. Mr. Nygaard served various roles of increasing responsibility on BWXT’s small modular reactor project—mPower™. He began his career with BWXT as a nuclear analyst and acting chief engineer for MIPS—a solution reactor development program to produce medical radioisotopes. He holds three U.S. patents and two pending for propriety technologies associated with the medical isotope production. Mr. Nygaard holds a bachelor’s and master’s degree in nuclear engineering from the University of Wisconsin–Madison where he was licensed by the U.S. Nuclear Regulatory Commission as a student operator of the University’s TRIGA reactor.
URL:https://engineering.wisc.edu/event/fireside-chat-deploying-the-next-generation-of-nuclear-energy/
LOCATION:Wisconsin
CATEGORIES:Nuclear Engineering & Engineering Physics
ATTACH;FMTTYPE=image/jpeg:https://engineering.wisc.edu/wp-content/uploads/2025/10/Engineers-Day-Fireside-Chat.avif
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