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SUMMARY:ECE Research Seminar Series: Dr. Junyi Zhao
DESCRIPTION:Soft Electronics & Systems for Sensing\, Perception\, and Feedback\n\n\n\n\n\n\n\nAbstract: Wearable technologies can support health span only when they are comfortable\, motion-robust\, and able to convert raw signals into actionable\, intuitive information. My research focuses on materials-device-system co-design of soft electronic systems that integrate three core functions\, sensing\, perception\, and feedback\, across healthcare and embodied interaction applications. \n\n\n\nIn this talk\, I will first introduce wearable systems for women’s health\, including maternal monitoring of cardiac and uterine contraction biopotentials in clinical settings for early risk detection of preterm birth. This platform leverages soft polymeric electrodes and textile-integrated interfaces designed for stable and wireless electrophysiological recording. Second\, I will present garment-integrated electrophysiology platforms for ambulatory biopotential monitoring in daily life\, including electrocardiography (ECG) and skeletal muscle electromyography (EMG) during strenuous activities such as exercise and water sports\, with an emphasis on maintaining signal fidelity under body motion. Third\, I will describe embodied tactile interfaces that enable robust touch and gesture recognition under deformation\, combining pressure mapping with personalized recognition for intelligent human-computer interaction. Fourth\, I will discuss semiconductor material processing and advanced manufacturing approaches for intrinsically soft optoelectronic devices\, including stretchable light-emitting diodes (LEDs) that provide low-burden\, glanceable visual feedback on wearables and everyday objects. Finally\, I will discuss future advances in intelligent wearables for personalized women’shealthcare and safe human-robot interaction. \n\n\n\nJunyi Zhao\n\n\n\nBio: Dr. Junyi Zhao is a Postdoctoral Scholar at Stanford University\, where he works with Professor Zhenan Bao to develop intelligent wearable electronics and medical robotics. He received his Ph.D. in Electrical Engineering from Washington University in St. Louis\, where he specialized in wearable biomedical electronics for women’s health\, as well as soft optoelectronic devices for light emission and photodetection. Previously\, he was a Research Scientist Intern at Meta Reality Labs (formerly Facebook)\, where he developed wearable tactile perception interfaces for immersive AR/VR and embodied human–computer interaction. \n\n\n\nDr. Zhao has authored over 20 publications\, including first-authored papers in Nature Photonics and Advanced Materials\, as well as papers in top-tier human–computer interaction venues such as ACM UIST. He has received multiple awards and recognitions\, including WiscProf: Future Faculty in Engineering\, CAS Future Leaders\, the MRS Graduate Student Gold Award\, PMSE Future Faculty\, the ACS Excellence in Graduate Polymer Research Award\, and the Nano Research Energy Young Star Researcher Gold Award.
URL:https://engineering.wisc.edu/event/ece-research-seminar-series-dr-junyi-zhao/
LOCATION:4610 Engineering Hall\, 1415 Engineering Drive\, Madison\, 53711
CATEGORIES:Electrical & Computer Engineering,Seminar
ATTACH;FMTTYPE=image/jpeg:https://engineering.wisc.edu/wp-content/uploads/2025/02/ECE-Research-Seminar-Series.avif
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20260507T151500
DTEND;TZID=America/Chicago:20260507T161500
DTSTAMP:20260604T192220
CREATED:20260430T165916Z
LAST-MODIFIED:20260430T170224Z
UID:10001521-1778166900-1778170500@engineering.wisc.edu
SUMMARY:ECE Research Seminar Series: Dr. Arindam Sanyal\, Arizona State University
DESCRIPTION:Machine Learning for In-Sensor Artificial Intelligence and High-performance Circuit Design\n\n\n\n\n\n\n\nAbstract: This talk focuses on application of machine-learning (ML) for imparting intelligence to sensing devices as well as lead to high-performance circuit design. As wireless sensors are more widely adopted\, the volume of data produced by these devices are expected to reach thousands of petabytes/month. Transmitting this large volume of data over the cloud for processing will potentially emerge as a communication bottleneck and increase latency of decisions. Transmitting naively all data generated by a wearable medical device is also costly in terms of power/energy- transmitter is usually the highest consumer of energy in a sensor (at least 10~20x more energy than sensing). Key to addressing this data deluge is to increase capabilities sensing devices to process information locally and have on-device inference capabilities\, such as through embedding AI capabilities into the wearable device that will allow extraction of key information from the sensor data. There needs to be balance between what can be processed locally on-device with low power/energy and how to optimally decide the volume of data communication from the device (to cloud as an example). The barriers to this approach lie in the computational complexity of AI algorithms that makes it challenging to fit AI models on wearables with limited resources. Some of the answers might lie in going back to early days of signal processing in silicon – developing analog circuit techniques for AI development which will require collaborative innovations in both AI model development and analog circuit design techniques. In this talk\, I will present our research on developing analog AI circuits and their demonstrations with use cases from health monitoring to IoT. \n\n\n\nThe second part of this talk will present ML approaches for enhancing performance of data converters. ML has the potential to emerge as an alternative to current signal processing based complex calibration algorithms for enhancing data converter performance in advanced processes. By learning an efficient representation of the input and data converter behavior\, a simple neural network can correct data converter errors arising from multiple sources of non-idealities with similar accuracy as complex calibration algorithms but with a much lower hardware cost. \n\n\n\nArindam Sanyal\n\n\n\nBio: Arindam Sanyal is currently an assistant professor in the School of Electrical\, Computer and Energy Engineering at Arizona State University. Prior to this\, he was an analog design engineer with Silicon Laboratories and assistant professor in State University of New York. He received his PhD in Electrical and Computer Engineering from the University of Texas at Austin in 2015\, his M.Tech from The Indian Institute of Technology\, Kharagpur in 2009 and B.E from Jadavpur University\, India in 2007.  Dr. Sanyal’s research expertise includes analog/mixed signal design\, bio-medical sensor design\, hardware security and neuromorphic computing. He serves in technical program committees for Custom Integrated Circuits Conference (CICC)\, Design Automation Conference (DAC)\, International Conference on Computer-Aided Design (ICCAD)\, VLSI Test Symposium (VTS)\, Analog Signal Processing Technical Committee (ASP-TC)\, and VLSI Systems and Applications Technical Committee (VSA-TC) within IEEE Circuits and Systems society\, and VLSI-D.
URL:https://engineering.wisc.edu/event/ece-research-seminar-series-dr-arindam-sanyal/
LOCATION:4610 Engineering Hall\, 1415 Engineering Drive\, Madison\, 53711
CATEGORIES:Electrical & Computer Engineering,Seminar
ATTACH;FMTTYPE=image/jpeg:https://engineering.wisc.edu/wp-content/uploads/2025/02/ECE-Research-Seminar-Series.avif
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BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20260226T160000
DTEND;TZID=America/Chicago:20260226T170000
DTSTAMP:20260604T192220
CREATED:20260220T141854Z
LAST-MODIFIED:20260224T191536Z
UID:10001470-1772121600-1772125200@engineering.wisc.edu
SUMMARY:ECE Semiconductor Materials Seminar Series: Dr. Kuangye Lu
DESCRIPTION:Seamless Monolithic 3D Heterogeneous Integration Enabled by Advanced Epitaxy\n\n\n\n\n\n\n\nAbstract: Three-dimensional heterogeneous integration (3D heterointegration) is emerging as the leading approach to enhancing performance in the field of microelectronics. However\, this method often relies on complex wafer-to-wafer bonding processes\, which introduce alignment challenges and interfacial defects. Alternatively\, heteroepitaxy offers another route for implementing 3D heterointegration but suffers from material degradation due to defects and strain caused by lattice and thermal mismatches.In this talk\, I will introduce three new epitaxy paradigms designed to address the key limitations of current 3D heterointegration processes. First\, I will discuss Remote Epitaxy\, which enables wafer-scale exfoliation of ultra-thin membranes across a broad range of materials. By leveraging a 2D interlayer\, these membranes can be transferred and monolithically 3D (M3D) integrated onto arbitrary substrates with ultra-high throughput and low cost\, effectively addressing the challenges associated with wafer-to-wafer bonding. I will then present 2D-Assisted Heteroepitaxy\, a technique that significantly reduces and\, in some cases\, eliminates defects in heteroepitaxy through strain relaxation mechanism at the 2D/3D interface. This advancement enhances materials quality and device performance over conventional heteroepitaxy\, broadening opportunities for M3D heterointegration. Lastly\, I will introduce single-crystal materials growth on amorphous substrates\, which is made possible with a bold substrate design and carefully engineered materials growth conditions\, offering an entirely new scheme of M3D heterointegration.Building on these epitaxy paradigms\, I will demonstrate various novel (opto)electronic devices as examples of their applications\, including fabrication of world’s smallest micro-LED pixels (based on Remote Epitaxy)\, defect-free direct growth of III-V on silicon for next-generation optoelectronic applications (based on 2D-Assisted Heteroepitaxy)\, and advanced 3D stacking of 2D transistors (based on single-crystal materials growth on amorphous substrates). I will conclude the talk with a perspective on future materials development that could enable innovations across advanced 3D logic/memory\, XR\, energy\, and quantum information\, driven by new devices built upon advances in M3D heterointegration. \n\n\n\nDr. Kuangye Lu\n\n\n\nBio: Dr. Kuangye Lu is currently a Postdoctoral Associate at the Research Laboratory of Electronics\, Massachusetts Institute of Technology (MIT). He earned his Ph.D. in Mechanical Engineering from MIT in 2023 under the supervision of Prof. Jeehwan Kim\, and earned a B.S. with honors in Physics from Zhejiang University (ZJU) in 2018.His research focuses on the invention and development of advanced epitaxy techniques for compound semiconductors and 2D materials\, as well as their heterointegration for device fabrication and applications. These efforts include the monolithic 3D integration of high-quality III-V optoelectronic devices on silicon\, reconfigurable AI chips\, and transistors engineered for next-generation advanced nodes.Dr. Lu has authored peer-reviewed articles in high-impact journals\, including Nature\, Nature Nanotechnology\, and Nature Electronics. He is the recipient of the Chu Ko-Chen Scholarship\, the highest honor for graduates of ZJU\, and the MIT Shangzhi Wu Fellowship. Additionally\, Dr. Lu has served as a conference organizer of Advanced Epitaxy of Freestanding Membranes and 2D Materials (AEFM) Conference and a Review Editor for Frontiers in Energy Research. He also serves as a reviewer for journals including Nature Chemical Engineering\, Science Advances\, and Nano Letters.
URL:https://engineering.wisc.edu/event/ece-semiconductor-materials-seminar-series-dr-kuangye-lu/
LOCATION:4610 Engineering Hall\, 1415 Engineering Drive\, Madison\, 53711
CATEGORIES:Electrical & Computer Engineering,Seminar
ATTACH;FMTTYPE=image/jpeg:https://engineering.wisc.edu/wp-content/uploads/2026/02/2026-Faculty-Recruiting-Seminars-Plain-for-website-2.avif
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BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20251104T120000
DTEND;TZID=America/Chicago:20251104T140000
DTSTAMP:20260604T192220
CREATED:20251028T184952Z
LAST-MODIFIED:20251028T190418Z
UID:10001357-1762257600-1762264800@engineering.wisc.edu
SUMMARY:WECE Coffee Break with Adria Brooks
DESCRIPTION:Join Women in Electrical and Computer Engineering (WECE) for a coffee break with ECE alumna Dr. Adria Brooks\, Director of Transmission Planning at Grid Strategies LLC. Stop by at any time from noon to 2:00 to enjoy free Einstein bagels and coffee. \n\n\n\nDr. Brooks is a recipient of a 2025 College of Engineering Early Career Award which will be presented on Engineers’ Day\, November 7. \n\n\n\nLinkedIn
URL:https://engineering.wisc.edu/event/wece-coffee-break-with-adria-brooks/
LOCATION:4610 Engineering Hall\, 1415 Engineering Drive\, Madison\, 53711
CATEGORIES:Alumni events,Electrical & Computer Engineering
ATTACH;FMTTYPE=image/png:https://engineering.wisc.edu/wp-content/uploads/2025/10/image-4.avif
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=America/Chicago:20250916T170000
DTEND;TZID=America/Chicago:20250916T180000
DTSTAMP:20260604T192220
CREATED:20250904T212308Z
LAST-MODIFIED:20250904T212421Z
UID:10001312-1758042000-1758045600@engineering.wisc.edu
SUMMARY:Rivos Tech Talk sponsored by IEEE-HKN
DESCRIPTION:Join us for an exciting tech talk with Rivos\, a leader in RISC-V technology\, as visiting members share insights into open instruction set architectures and their real-world applications. This event is tailored for students with a background in computer architecture who are eager to learn more about cutting-edge developments in the field.Don’t miss the opportunity to engage directly with industry experts and ask questions!  \n\n\n\nPizza will be available for all attendees. \n\n\n\n4610 Engineering Hall \n\n\n\n\nSign Up Today!
URL:https://engineering.wisc.edu/event/rivos-tech-talk-sponsored-by-ieee-hkn/
LOCATION:4610 Engineering Hall\, 1415 Engineering Drive\, Madison\, 53711
CATEGORIES:Electrical & Computer Engineering,Student Org Event
ATTACH;FMTTYPE=image/jpeg:https://engineering.wisc.edu/wp-content/uploads/2023/09/Eta-Kappa-Nu-jpg-webp.webp
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